Invention Grant
- Patent Title: Method for manufacturing heat sink having heat-dissipating fins and structure of the same
- Patent Title (中): 制造具有散热翅片的散热片及其结构的方法
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Application No.: US12073720Application Date: 2008-03-10
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Publication No.: US08087456B2Publication Date: 2012-01-03
- Inventor: Wen-Chen Wei
- Applicant: Wen-Chen Wei
- Applicant Address: TW Taipei Hisen
- Assignee: Neng Tyi Precision Industries Co., Ltd.
- Current Assignee: Neng Tyi Precision Industries Co., Ltd.
- Current Assignee Address: TW Taipei Hisen
- Agency: Rosenberg, Klein & Lee
- Priority: TW97101661A 20080116
- Main IPC: F28F7/00
- IPC: F28F7/00

Abstract:
A method for manufacturing a heat sink having heat-dissipating fins and a structure of the same are provided. The method includes the steps of: providing a substrate comprising a center portion and a plurality of extending arms, a gap being provided between each two adjacent extending arms; providing a plurality of heat-dissipating fins, the heat-dissipating fins being inserted into the gaps between the extending arms, each heat-dissipating fin comprising a base piece and two heat-dissipating plates; and bending and pressing each extending arm of the substrate with one of the two opposite side walls of each extending arm abutting against one of the two opposite surface of each heat-dissipating plate. Via the above arrangement, the present invention has an effect of avoiding the heat transfer loss.
Public/Granted literature
- US20090178794A1 Method for manufacturing heat sink having heat-dissipating fins and structure of the same Public/Granted day:2009-07-16
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