Invention Grant
- Patent Title: Sound absorber for a pipe-shaped, cavity-forming body
- Patent Title (中): 用于管状空腔形成体的吸声器
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Application No.: US12903793Application Date: 2010-10-13
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Publication No.: US08087493B2Publication Date: 2012-01-03
- Inventor: Dominik Kempf , Denny Liers , Olaf Emmerich
- Applicant: Dominik Kempf , Denny Liers , Olaf Emmerich
- Applicant Address: DE Heidelberg
- Assignee: TI Automotive Engineering Centre (Heidelberg) GmbH
- Current Assignee: TI Automotive Engineering Centre (Heidelberg) GmbH
- Current Assignee Address: DE Heidelberg
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: EP09013111 20091016
- Main IPC: F01N1/02
- IPC: F01N1/02 ; F01N1/10 ; F02M35/00

Abstract:
The present invention relates to a coolant circuit of a cooling system including a pipe-shaped body defining a cavity. It has a sound absorber defining a flow channel and at least one resonator chamber which is connected to the flow channel via a connection channel. The sound absorber is an insert in the cavity of the pipe-shaped body, which forms the flow channel, the at least one resonator chamber, and the at least one connection channel.
Public/Granted literature
- US20110088968A1 SOUND ABSORBER FOR A PIPE-SHAPED, CAVITY-FORMING BODY Public/Granted day:2011-04-21
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