Invention Grant
- Patent Title: Process of filling openings in a component
- Patent Title (中): 填充部件中的开口的过程
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Application No.: US12206033Application Date: 2008-09-08
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Publication No.: US08087565B2Publication Date: 2012-01-03
- Inventor: Srikanth Chandrudu Kottilingam , Charles Gitahi Mukira , Warren Martin Miglietti , Arthur S. Peck , Christopher Penny , Yan Cui , Steven Rauch
- Applicant: Srikanth Chandrudu Kottilingam , Charles Gitahi Mukira , Warren Martin Miglietti , Arthur S. Peck , Christopher Penny , Yan Cui , Steven Rauch
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agent Ernest G. Cusick; Gary M. Hartman; Domenica N. S. Hartman
- Main IPC: B23K31/00
- IPC: B23K31/00 ; B23P6/04

Abstract:
A process for filling openings, including blind holes, through-holes, and cavities, in high temperature components. The process entails forming a powder mixture by mixing particles of at least a base alloy and a second alloy that contains a sufficient amount of a melting point depressant to have a lower melting temperature than the base alloy. The powder mixture is combined with a binder and compacted to form a compacted preform, which is then heated to remove the binder and form a rigid sintered preform. The sintered preform is produced, or optionally is further shaped, to have a cross-sectional shape and dimensions to achieve a clearance of up to 200 micrometers with the opening, after which the preform is placed in the opening and diffusion bonded within the opening to form a brazement comprising the particles of the base alloy dispersed in a matrix formed by the second alloy.
Public/Granted literature
- US20100059573A1 PROCESS OF FILLING OPENINGS IN A COMPONENT Public/Granted day:2010-03-11
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