Proposed is a method for producing a portable data carrier (100) starting out from a film carrier (10) having disposed on its upper side (14) a contact layout (28), and on its underside (16) a semiconductor circuit (20) connected to the contact layout. The thus prepared film carrier (10) is put into an injection mold (30) where an injection molding process is performed in which a molded body (40) having an outer contour (102) corresponding to a standard specification for the outer dimensions of a portable data carrier is formed on the underside (16) around the semiconductor circuit (20).