Invention Grant
- Patent Title: Diamond cutting member and method of making the same
- Patent Title (中): 金刚石切割件及其制作方法
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Application No.: US12227851Application Date: 2007-10-05
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Publication No.: US08087852B2Publication Date: 2012-01-03
- Inventor: Harukazu Muraki , Youichiro Shimoda
- Applicant: Harukazu Muraki , Youichiro Shimoda
- Applicant Address: JP Toyokawa-shi JP Takashima-shi
- Assignee: OSG Corporation,Nissin Diamond Tool Mfg. Co., Ltd.
- Current Assignee: OSG Corporation,Nissin Diamond Tool Mfg. Co., Ltd.
- Current Assignee Address: JP Toyokawa-shi JP Takashima-shi
- Agency: Oliff & Berridge, PLC
- International Application: PCT/JP2007/069627 WO 20071005
- International Announcement: WO2009/044488 WO 20090409
- Main IPC: B23B29/12
- IPC: B23B29/12 ; B23B27/18 ; B23P15/30

Abstract:
A shank has a mount reference surface formed with a mount seat having a mount seat surface inclined at a given inclined angle α. A diamond raw material is held on the shank in an attitude such that a first bottom surface thereof is in tight contact with the mount seat surface, and a first apex is protruded forward nearly along a centerline of the shank. A portion of the first apex, protruding from the mount reference surface, is ground and removed as a given inclined angle θ. This causes a surface or its vicinity (in a value less thank approximately ±1°) to be formed as a raked face. The first bottom surface of the diamond raw material is held intact in tight contact with the mount seat surface to be integrally bonded thereto by active metal brazing, easily ensuring an increased bonding surface area to easily obtain increased bonding strength. This results in a further remarkable reduction in manufacturing time and manufacturing cost as those achieved in a case where a portion of a seconds apex opposite to the first apex formed with the raked face is grounded and removed to forma a bonding member.
Public/Granted literature
- US20100003091A1 Diamond Cutting Member and Method of Making the Same Public/Granted day:2010-01-07
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