Invention Grant
- Patent Title: Imprint lithography with improved substrate/mold separation
- Patent Title (中): 印刷光刻与改进的基板/模具分离
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Application No.: US12691202Application Date: 2010-01-21
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Publication No.: US08087922B2Publication Date: 2012-01-03
- Inventor: Wei Zhang , Hua Tan , Lin Hu , Stephen Y. Chou
- Applicant: Wei Zhang , Hua Tan , Lin Hu , Stephen Y. Chou
- Agency: Polster, Lieder, Woodruff & Lucchesi, LC
- Main IPC: B29C59/00
- IPC: B29C59/00 ; B28B7/10

Abstract:
In imprint lithography, a mold having a pattern of projecting and recessed regions is pressed into a moldable surface on a substrate. The thus-imprinted moldable surface is permitted to at least partially harden to retain the imprint, and the substrate and mold are separated. In accordance with the invention, the substrate is separated from the mold by bending laterally distal regions (regions away from the center toward the edges) of the mold transversely away from the interface and transversely restraining the substrate. The mold can then be easily separated from the substrate by transverse displacement. The separation can be facilitated by providing a mold having a lateral dimension that on at least two sides extends beyond the corresponding lateral dimension of the substrate. Alternatively, the substrate can have a greater lateral extent than the mold, and the mold can be restrained. The distal regions of the substrate can be bent in the transverse direction. Apparatus for effecting such separation is also described.
Public/Granted literature
- US20100119641A1 IMPRINT LITHOGRAPHY WITH IMPROVED SUBSTRATE/MOLD SEPARATION Public/Granted day:2010-05-13
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