Invention Grant
US08087953B2 Surface mount device jumper and surface mount device jumper assembly
失效
表面贴装器件跳线和表面贴装器件跳线组件
- Patent Title: Surface mount device jumper and surface mount device jumper assembly
- Patent Title (中): 表面贴装器件跳线和表面贴装器件跳线组件
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Application No.: US12078496Application Date: 2008-04-01
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Publication No.: US08087953B2Publication Date: 2012-01-03
- Inventor: Yoshinari Matsuda , Rogelio Ruiz
- Applicant: Yoshinari Matsuda , Rogelio Ruiz
- Applicant Address: JP Tokyo US NJ Park Ridge
- Assignee: Sony Corporation,Sony Electronics Inc.
- Current Assignee: Sony Corporation,Sony Electronics Inc.
- Current Assignee Address: JP Tokyo US NJ Park Ridge
- Agency: Rader, Fishman & Grauer PLLC
- Main IPC: H01R31/08
- IPC: H01R31/08 ; H05K7/06
Abstract:
A surface mount device jumper includes a base member and an electrode member. The base member is fabricated from a resin laminate. The electrode member is fabricated from an electrically-conductive material and is formed in a generally C-shaped configuration to define an opening therethrough. The opening is sized to receive the base member such that the electrode member partially wraps around and clamps to the base member to retain the base member in the opening.
Public/Granted literature
- US20090242237A1 Surface mount device jumper and surface mount device jumper assembly Public/Granted day:2009-10-01
Information query
