Invention Grant
US08087967B2 Image display device and its manufacturing method with particular light-heat-curing resin composition
有权
图像显示装置及其具有特定光热固化树脂组合物的制造方法
- Patent Title: Image display device and its manufacturing method with particular light-heat-curing resin composition
- Patent Title (中): 图像显示装置及其具有特定光热固化树脂组合物的制造方法
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Application No.: US12309106Application Date: 2008-07-16
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Publication No.: US08087967B2Publication Date: 2012-01-03
- Inventor: Yoshihisa Shinya , Kenji Kamiya , Yusuke Kamata
- Applicant: Yoshihisa Shinya , Kenji Kamiya , Yusuke Kamata
- Applicant Address: JP Tokyo
- Assignee: Sony Chemical & Information Device Corporation
- Current Assignee: Sony Chemical & Information Device Corporation
- Current Assignee Address: JP Tokyo
- Agent Manabu Kanesaka
- Priority: JP2007-186360 20070717; JP2008-105055 20080414; JP2008-005027 20081101
- International Application: PCT/JP2008/062852 WO 20080716
- International Announcement: WO2009/011366 WO 20090122
- Main IPC: H01J9/00
- IPC: H01J9/00 ; G02F1/1333 ; G02F1/1339

Abstract:
Manufacture a highly reliable image display device capable of proceeding with resin cure even in the case where a protective panel is provided with a light shielding portion. A liquid crystal display unit 2 having a liquid crystal display panel 8 and a light transmissive protective panel 3 having a light shielding portion 5 are disposed face to face, a resin composition 10 is interposed between the liquid crystal display unit and the protective panel, and the resin composition is cured into a cured resin layer 11. As the resin composition 10, a light-heat-curing resin composition and containing a photopolymerization initiator and organic peroxide of thermal polymerization initiator is used. In curing the resin composition 10, cure by light (ultraviolet rays) irradiation is performed until a cure ratio of the resin composition becomes 30% or more and thereafter thermal cure is performed.
Public/Granted literature
- US20090186552A1 IMAGE DISPLAY DEVICE AND ITS MANUFACTURING METHOD Public/Granted day:2009-07-23
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