Invention Grant
- Patent Title: Spectra based endpointing for chemical mechanical polishing
- Patent Title (中): 基于光谱的化学机械抛光终点
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Application No.: US12182076Application Date: 2008-07-29
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Publication No.: US08088298B2Publication Date: 2012-01-03
- Inventor: Boguslaw A. Swedek , Dominic J. Benvegnu , Jeffrey D. David
- Applicant: Boguslaw A. Swedek , Dominic J. Benvegnu , Jeffrey D. David
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- Main IPC: C03C15/00
- IPC: C03C15/00

Abstract:
Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting two or more reference spectra. Each reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than a target thickness. The reference spectra is selected for particular spectra-based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectra-based endpoint logic. The method includes obtaining two or more current spectra. Each current spectrum is a spectrum of white light reflected from a film of interest on a second substrate when the film of interest is being subjected to a polishing step and has a current thickness that is greater than the target thickness. The method includes determining, for the second substrate, when an endpoint of the polishing step has been achieved.
Public/Granted literature
- US20090017726A1 SPECTRA BASED ENDPOINTING FOR CHEMICAL MECHANICAL POLISHING Public/Granted day:2009-01-15
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