A method for producing a panel assembly is provided. The panel assembly includes a panel and a gasket adhered to the panel and extending along at least a portion of the periphery. A curable composition is applied either directly or indirectly onto the panel and onto a mold surface onto which the panel has been positioned. When being applied on the mold surface, the curable composition has a dynamic viscosity which is lower than the dynamic viscosity of extrusion materials. In this way, a better surface quality can be achieved without having to exert a high pressure onto the curable composition. In contrast to the known RIM processes, the curable composition is not injected in a closed mold but is applied onto an open mold surface by means of an applicator device moving along at least the portion of the periphery of the panel.