Invention Grant
- Patent Title: Method of molding a microneedle
- Patent Title (中): 成型微针的方法
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Application No.: US11720480Application Date: 2005-12-07
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Publication No.: US08088321B2Publication Date: 2012-01-03
- Inventor: Dennis E. Ferguson , Satinder K. Nayar , Donald L. Pochardt
- Applicant: Dennis E. Ferguson , Satinder K. Nayar , Donald L. Pochardt
- Applicant Address: US MN St. Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN St. Paul
- International Application: PCT/US2005/044121 WO 20051207
- International Announcement: WO2006/062974 WO 20060615
- Main IPC: B29C45/56
- IPC: B29C45/56

Abstract:
A method of molding a microneedle using a mold apparatus that comprises a mold insert (210)having the negative image of at least one microneedle (12), a compression core (240), and a mold housing configured to allow a reciprocal motion between the mold insert and the compression core. The mold apparatus has an open position and a closed position. The mold apparatus is placed in the closed position and polymeric material is injected into the closed mold apparatus. The injected polymeric material is compressed between the mold insert and the compression core by a reciprocal motion between the compression core and the mold insert. Also, molding methods wherein the mold apparatus has sidewalls having an injection gate (270). Also, molding methods comprising a heated mold insert. Also, molding methods comprising the application of high frequency acoustic energy, such as ultrasonic energy, to the mold apparatus.
Public/Granted literature
- US20080088066A1 Method Of Molding A Microneedle Public/Granted day:2008-04-17
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