Invention Grant
US08088401B2 Composite material comprising a porous semiconductor impregnated with an organic substance 有权
复合材料包括浸渍有机物质的多孔半导体

  • Patent Title: Composite material comprising a porous semiconductor impregnated with an organic substance
  • Patent Title (中): 复合材料包括浸渍有机物质的多孔半导体
  • Application No.: US10576448
    Application Date: 2004-10-21
  • Publication No.: US08088401B2
    Publication Date: 2012-01-03
  • Inventor: Roghieh SaffieLeigh Canham
  • Applicant: Roghieh SaffieLeigh Canham
  • Applicant Address: GB Malvern, Worcestershire
  • Assignee: Psimedica Limited
  • Current Assignee: Psimedica Limited
  • Current Assignee Address: GB Malvern, Worcestershire
  • Agency: Nixon & Vanderhye P.C.
  • Priority: GB0324482.9 20031021; GB0324483.7 20031021
  • International Application: PCT/GB2004/004460 WO 20041021
  • International Announcement: WO2005/042023 WO 20050512
  • Main IPC: A61F2/02
  • IPC: A61F2/02
Composite material comprising a porous semiconductor impregnated with an organic substance
Abstract:
The invention provides a composite material comprising a porous semiconductor impregnated with at least one beneficial organic substance, wherein the beneficial organic substance is present in an amount of at least 15% by weight, based on the weight of the material. Also provided are methods for the preparation of such materials, pharmaceutical compositions comprising them and their use in methods of treatment.
Information query
Patent Agency Ranking
0/0