Invention Grant
US08088435B2 Mask, method for producing mask, and method for producing wired board
有权
面膜，生产面膜的方法以及生产线路板的方法
- Patent Title: Mask, method for producing mask, and method for producing wired board
- Patent Title (中): 面膜，生产面膜的方法以及生产线路板的方法
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Application No.: US11277921Application Date: 2006-03-29
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Publication No.: US08088435B2Publication Date: 2012-01-03
- Inventor: Masanori Tsuruko
- Applicant: Masanori Tsuruko
- Applicant Address: JP Nagoya-shi, Aichi-ken
- Assignee: Brother Kogyo Kabushiki Kaisha
- Current Assignee: Brother Kogyo Kabushiki Kaisha
- Current Assignee Address: JP Nagoya-shi, Aichi-ken
- Agency: Baker Botts L.L.P.
- Priority: JP2005-099520 20050330
- Main IPC: B05D5/12
- IPC: B05D5/12
Abstract:
A mask, through which a plurality of slender through-holes are formed, has a reinforcing section which is formed to span the through-holes, wherein recesses are provided at portions of the reinforcing section to cover the through-holes. Accordingly, a metal, which is subjected to the sputtering, easily makes the detour around the reinforcing section. Therefore, a metal film is easily formed even on portions shadowed by the reinforcing section. It is possible to accurately form a fine wiring pattern.
Public/Granted literature
- US20060222965A1 Mask, Method for Producing Mask, and Method for Producing Wired Board Public/Granted day:2006-10-05
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