Invention Grant
- Patent Title: Method and apparatus for applying electrode mixture paste
- Patent Title (中): 施加电极混合糊的方法和装置
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Application No.: US11919236Application Date: 2006-04-11
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Publication No.: US08088444B2Publication Date: 2012-01-03
- Inventor: Kimihiro Imamura , Hiroyuki Usui , Tadakazu Seto
- Applicant: Kimihiro Imamura , Hiroyuki Usui , Tadakazu Seto
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2005-126289 20050425
- International Application: PCT/JP2006/307616 WO 20060411
- International Announcement: WO2006/115034 WO 20061102
- Main IPC: H01M4/10
- IPC: H01M4/10 ; H01M4/26 ; H01M4/02 ; H01M4/04 ; H01M4/64 ; B05C17/025

Abstract:
An electrode mixture paste (5) is applied on both sides of a strip of core material (1) made of porous metal sheet that is running along its lengthwise direction. The paste-coated core material (1) is pressed with press rollers (15a, 15b) alternately from opposite sides once or more, after which the paste-coated core material (1) is passed through the gap between a pair of scraper tools (16a, 16b) to adjust the coating thickness of the paste (5), while the position of the core material (1) is restricted with comb-shaped projections (17a or 17a, 17b), so that, even though the projections (17a, 17b) are distanced from each other sufficiently to allow weld points of the core material (1) to pass through, the coating thickness is precisely regulated. Therefore, a method of applying an electrode mixture paste is realized, with which coating thickness is precisely adjusted and, even in a continuous production process in which core materials are connected together by welding, production failures due to weld points being stuck are prevented.
Public/Granted literature
- US20090007843A1 Method and apparatus for applying electrode mixture paste Public/Granted day:2009-01-08
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