Invention Grant
- Patent Title: Resist top coat composition and patterning process
- Patent Title (中): 抵抗面漆组合和图案化工艺
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Application No.: US12320183Application Date: 2009-01-21
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Publication No.: US08088537B2Publication Date: 2012-01-03
- Inventor: Jun Hatakeyama , Yuji Harada
- Applicant: Jun Hatakeyama , Yuji Harada
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2008-021021 20080131
- Main IPC: G03F7/26
- IPC: G03F7/26 ; G03F7/11 ; C08L33/02

Abstract:
The present invention relates to a resist top coat composition and a patterning process adopting such a material, which resist top coat composition is provided for forming a top coat on a photoresist film so as to protect the photoresist film, in liguid immersion photolithography. The present invention provides a resist top coat composition for forming a top coat on a photoresist film, wherein the resist top coat composition comprises, at least: a polymer I including a repeating unit a represented by the following general formula (1); and a polymer II including repeating unit having a sulfonic acid or an amine salt of a sulfonic acid:
Public/Granted literature
- US20090197200A1 Resist top coat composition and patterning process Public/Granted day:2009-08-06
Information query
IPC分类: