Invention Grant
- Patent Title: Positive resist composition and pattern forming method
- Patent Title (中): 正抗蚀剂组成和图案形成方法
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Application No.: US12181757Application Date: 2008-07-29
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Publication No.: US08088550B2Publication Date: 2012-01-03
- Inventor: Shinji Tarutani , Hideaki Tsubaki , Kenji Wada
- Applicant: Shinji Tarutani , Hideaki Tsubaki , Kenji Wada
- Applicant Address: JP Tokyo
- Assignee: Fujifilm Corporation
- Current Assignee: Fujifilm Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2007-198055 20070730
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/30

Abstract:
A positive resist composition, includes: (A) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (B) a resin of which solubility in an alkali developer increases under an action of an acid; (C) a compound capable of decomposing under an action of an acid to generate an acid; and (D) a compound which itself acts as a base for the acids generated from the component (A) and the component (C) but decomposes upon irradiation with actinic rays or radiation to lose a basicity for the acids generated from the component (A) and the component (C).
Public/Granted literature
- US20090035692A1 POSITIVE RESIST COMPOSITION AND PATTERN FORMING MEHTOD Public/Granted day:2009-02-05
Information query
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