Invention Grant
US08088554B2 Bottom resist layer composition and patterning process using the same
有权
底部抗蚀剂层组成和使用其的图案化工艺
- Patent Title: Bottom resist layer composition and patterning process using the same
- Patent Title (中): 底部抗蚀剂层组成和使用其的图案化工艺
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Application No.: US12656825Application Date: 2010-02-17
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Publication No.: US08088554B2Publication Date: 2012-01-03
- Inventor: Jun Hatakeyama
- Applicant: Jun Hatakeyama
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd
- Current Assignee: Shin-Etsu Chemical Co., Ltd
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2005-116897 20050414
- Main IPC: G03F7/00
- IPC: G03F7/00 ; G03F7/004

Abstract:
There is disclosed a bottom resist layer composition for a multilayer-resist film used in lithography which comprises, at least, a polymer having a repeating unit represented by the following general formula (1). Thereby, there can be provided a bottom resist layer composition which shows an antireflection effect against an exposure light by combining with an intermediate resist layer having an antireflection effect if necessary, has a higher etching resistance during etching a substrate than polyhydroxy styrene, cresol novolac resin, etc., has a high poisoning-resistant effect, and is suitable for using in a multilayer-resist process like a bilayer resist process or a trilayer resist process.
Public/Granted literature
- US20100151382A1 Bottom resist layer composition and patterning process using the same Public/Granted day:2010-06-17
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