Invention Grant
- Patent Title: Solid-state image pickup device
- Patent Title (中): 固态图像拾取装置
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Application No.: US11978453Application Date: 2007-10-29
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Publication No.: US08088639B2Publication Date: 2012-01-03
- Inventor: Takayuki Ezaki , Teruo Hirayama
- Applicant: Takayuki Ezaki , Teruo Hirayama
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Rader, Fishman & Grauer PLLC
- Priority: JPP2004-028353 20040204
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/336 ; H01L27/148 ; H01L29/768 ; H01L31/062 ; H01L31/113
Abstract:
A solid-state image pickup device includes a semiconductor substrate within which a pixel comprised of a photodiode and a transistor is formed. The transistor is formed at a surface of the semiconductor substrate, a pn junction portion formed between high concentration regions of the photodiode is provided within the semiconductor substrate and a part of the pn junction portion of the photodiode is extended to a lower portion of the transistor formed at the surface of the semiconductor substrate.
Public/Granted literature
- US20080083940A1 Solid-state image pickup device Public/Granted day:2008-04-10
Information query
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