Invention Grant
- Patent Title: Producing a transferred layer by implanting ions through a sacrificial layer and an etching stop layer
- Patent Title (中): 通过将牺牲层和蚀刻停止层注入离子来产生转移层
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Application No.: US12999452Application Date: 2008-06-20
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Publication No.: US08088672B2Publication Date: 2012-01-03
- Inventor: Tien-Hsi Lee , Ching-Han Huang , Chao-Liang Chang , Yao-Yu Yang
- Applicant: Tien-Hsi Lee , Ching-Han Huang , Chao-Liang Chang , Yao-Yu Yang
- Applicant Address: TW Taipei
- Assignee: Tien-Hsi Lee
- Current Assignee: Tien-Hsi Lee
- Current Assignee Address: TW Taipei
- Agency: Stites & Harbison PLLC
- Agent Juan Carlos A. Marquez, Esq.
- International Application: PCT/CN2008/001209 WO 20080620
- International Announcement: WO2009/152648 WO 20091223
- Main IPC: H01L21/30
- IPC: H01L21/30 ; H01L21/00

Abstract:
A method for producing a thin film includes the following steps: providing a primary substrate; forming an etching stop layer on the primary substrate; forming a sacrificial layer on the etching stop layer; implanting gas ions to form an ion implantation peak layer, which defines an effective transferred layer and a remnant layer; and separating the effective transferred layer from the remnant layer. The thickness of the effective transferred layer can be effectively determined by controlling the thickness of the sacrificial layer. Moreover, the thickness of the effective transferred layer can be uniform and then the effective transferred layer can become a nanoscale thin film.
Public/Granted literature
- US20110097873A1 METHOD FOR PRODUCING THIN FILM Public/Granted day:2011-04-28
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