Invention Grant
US08088681B2 Method for fabricating integrated circuit including separated diffusion regions of different type each having four gate electrodes with each of two complementary gate electrode pairs formed from respective linear condcutive segment 有权
制造集成电路的方法,该集成电路包括不同类型的分离扩散区,每个具有四个栅电极,每个栅电极由相应的线性调节段

  • Patent Title: Method for fabricating integrated circuit including separated diffusion regions of different type each having four gate electrodes with each of two complementary gate electrode pairs formed from respective linear condcutive segment
  • Patent Title (中): 制造集成电路的方法,该集成电路包括不同类型的分离扩散区,每个具有四个栅电极,每个栅电极由相应的线性调节段
  • Application No.: US12572194
    Application Date: 2009-10-01
  • Publication No.: US08088681B2
    Publication Date: 2012-01-03
  • Inventor: Scott T. BeckerMichael C. Smayling
  • Applicant: Scott T. BeckerMichael C. Smayling
  • Applicant Address: US CA Los Gatos
  • Assignee: Tela Innovations, Inc.
  • Current Assignee: Tela Innovations, Inc.
  • Current Assignee Address: US CA Los Gatos
  • Agency: Martine Penilla Group, LLP
  • Main IPC: H01L21/3205
  • IPC: H01L21/3205
Method for fabricating integrated circuit including separated diffusion regions of different type each having four gate electrodes with each of two complementary gate electrode pairs formed from respective linear condcutive segment
Abstract:
A cell layout of a semiconductor device includes a diffusion level layout including a plurality of diffusion region layout shapes, including p-type and n-type diffusion regions separated by a central inactive region. The cell layout also includes a gate electrode level layout for the entire cell defined to include linear-shaped layout features placed to extend in only a first parallel direction. Adjacent linear-shaped layout features that share a common line of extent in the first parallel direction are separated from each other by an end-to-end spacing that is substantially equal and minimized across the gate electrode level layout. Linear-shaped layout features within the gate electrode level layout extend over one or more of the p-type and/or n-type diffusion regions to form PMOS and NMOS transistor devices. A number of the PMOS transistor devices is equal to a number of the NMOS transistor devices in the cell.
Information query
IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件;其他类目中不包括的电固体器件(使用半导体器件的测量入G01;一般电阻器入H01C;磁体、电感器、变压器入H01F;一般电容器入H01G;电解型器件入H01G9/00;电池组、蓄电池入H01M;波导管、谐振器或波导型线路入H01P;线路连接器、汇流器入H01R;受激发射器件入H01S;机电谐振器入H03H;扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R;一般电光源入H05B;印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K;在具有特殊应用的电路中使用的半导体器件见应用相关的小类)
H01L21/00 专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02 .半导体器件或其部件的制造或处理
H01L21/04 ..至少具有一个跃变势垒或表面势垒的器件,例如PN结、耗尽层、载体集结层
H01L21/18 ...器件有由周期表Ⅳ族元素或含有/不含有杂质的AⅢBⅤ族化合物构成的半导体,如掺杂材料
H01L21/30 ....用H01L21/20至H01L21/26各组不包含的方法或设备处理半导体材料的(在半导体材料上制作电极的入H01L21/28)
H01L21/31 .....在半导体材料上形成绝缘层的,例如用于掩膜的或应用光刻技术的(密封层入H01L21/56);以及这些层的后处理;这些层的材料的选择
H01L21/3205 ......非绝缘层的沉积,例如绝缘层上的导电层或电阻层;这些层的后处理(电极的制造入H01L21/28)
Patent Agency Ranking
0/0