An improved apparatus and a method for semiconductor wafer bumping, that utilizes the injection molded solder process. The apparatus is designed for high volume manufacturing and includes equipment for filling patterned mold cavities formed on a first surface of a mold structure with solder, equipment for positioning and aligning a patterned first surface of a semiconductor structure directly opposite to the solder filled patterned mold cavities of the mold structure, a fixture tool for holding and transferring the aligned mold and semiconductor structures together, and equipment for receiving the fixture tool and transferring the solder from the aligned patterned mold cavities to the aligned patterned semiconductor first surface. The fixture tool includes a frame having a central aperture dimensioned to support a substrate and one or more clamp/spacer assemblies arranged symmetrically around the frame. Each clamp/spacer assembly includes a clamp configured to clamp the aligned mold and semiconductor structures together and a spacer configured to be inserted between the semiconductor structure and the mold structure.