Invention Grant
- Patent Title: Substrate treatment method
- Patent Title (中): 底物处理方法
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Application No.: US11542138Application Date: 2006-10-04
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Publication No.: US08088693B2Publication Date: 2012-01-03
- Inventor: Yoshimichi Shiki , Seiji Oda , Hayato Iwamoto , Yoshiya Hagimoto
- Applicant: Yoshimichi Shiki , Seiji Oda , Hayato Iwamoto , Yoshiya Hagimoto
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Rader, Fishman & Grauer PLLC
- Priority: JPP2005-299579 20051014; JPP2006-216540 20060809
- Main IPC: H01L21/302
- IPC: H01L21/302
Abstract:
There is provided a substrate treatment method for performing treatment by feeding a chemical liquid to a surface of a substrate, in which, before feeding the chemical liquid to a predetermined area of the substrate, a liquid substance having a resistivity lower than that of the chemical liquid is fed to the surface of the substrate so that the liquid substance wets at least the predetermined area, and then, the chemical liquid is fed to the predetermined area so that the treatment is performed on the substrate with the chemical liquid fed to the surface of the substrate.
Public/Granted literature
- US20070105242A1 Substrate treatment method Public/Granted day:2007-05-10
Information query
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