Invention Grant
- Patent Title: Bonded body, bonding material composition, honeycomb segment bonded body, and honeycomb structure using the same
- Patent Title (中): 接合体，接合材料组成，蜂窝体结合体和使用其的蜂窝结构体
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Application No.: US12235379Application Date: 2008-09-22
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Publication No.: US08088702B2Publication Date: 2012-01-03
- Inventor: Takahiro Tomita , Kenji Morimoto
- Applicant: Takahiro Tomita , Kenji Morimoto
- Applicant Address: JP Nagoya
- Assignee: NGK Insulators, Ltd.
- Current Assignee: NGK Insulators, Ltd.
- Current Assignee Address: JP Nagoya
- Agency: Oliff & Berridge, PLC
- Priority: JP2006-082103 20060324
- Main IPC: C04B38/00
- IPC: C04B38/00 ; B32B3/12 ; B01D39/06
Abstract:
There is provided a bonding material composition capable of suppressing crack generation on an end face of a resultant honeycomb structure to a large extent by reducing anisotropy of Young's modulus after curing of the bonding material by the use of an isotropic filler without using inorganic fibers. The bonded body has two or more members unitarily bonded by means of a bonding material layer, and the relational expression of 0.5
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