Invention Grant
- Patent Title: Printed circuit board assembly
- Patent Title (中): 印刷电路板组装
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Application No.: US12057654Application Date: 2008-03-28
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Publication No.: US08089003B2Publication Date: 2012-01-03
- Inventor: Wen-Chin Lee , Cheng-Hsien Lin
- Applicant: Wen-Chin Lee , Cheng-Hsien Lin
- Applicant Address: TW Tayuan, Taoyuan
- Assignee: Zhen Ding Technology Co., Ltd.
- Current Assignee: Zhen Ding Technology Co., Ltd.
- Current Assignee Address: TW Tayuan, Taoyuan
- Agency: Altis Law Group, Inc.
- Priority: CN200710076565 20070824
- Main IPC: H05K1/02
- IPC: H05K1/02

Abstract:
A printed circuit board substrate includes an insulation matrix and a waterproof layer. The insulation matrix includes a first surface and a second surface at an opposite side thereof to the first surface. The waterproof layer is formed in the insulation matrix and is arranged between the first surface and the second surface for blocking water from passing therethrough in a thicknesswise direction of the insulation matrix.
Public/Granted literature
- US20090050354A1 PRINTED CIRCUIT BOARD SUBSTRATE AND PRINTED CIRCUIT BOARD HAVING THE SAME Public/Granted day:2009-02-26
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