Invention Grant
- Patent Title: Liquid logic structures for electronic device applications
- Patent Title (中): 用于电子设备应用的液体逻辑结构
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Application No.: US11569412Application Date: 2005-05-20
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Publication No.: US08089013B2Publication Date: 2012-01-03
- Inventor: Andrew J. Steckl , Jason C. Heikenfeld
- Applicant: Andrew J. Steckl , Jason C. Heikenfeld
- Applicant Address: US OH Cincinnati
- Assignee: University of Cincinnati
- Current Assignee: University of Cincinnati
- Current Assignee Address: US OH Cincinnati
- Agency: Wood, Herron & Evans, LLP
- International Application: PCT/US2005/017752 WO 20050520
- International Announcement: WO2005/114740 WO 20051201
- Main IPC: H01H29/00
- IPC: H01H29/00

Abstract:
Electronic devices (10, 30, 50) utilizing electrically-controlled liquid components to accomplish device switching. Electric fields are used in a device structure to manipulate the position and/or geometrical shape of a conductive fluid or liquid (60, 24) using electrowetting. This manipulation regulates the flow of current between electrodes of the device structure, such as the source and drain regions (16, 20) of a transistor construction, by bridging a non-conductive channel (15) separating the electrodes (16, 20) so that the electrodes (16, 20) are electrically coupled.
Public/Granted literature
- US20070221484A1 Liquid Logic Structures for Electronic Device Applications Public/Granted day:2007-09-27
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