The present invention provides a heating apparatus for heating objects to be processed, which can detect a temperature of the objects to be processed with higher precision and accuracy, thereby to achieve higher precision temperature control. A heating apparatus 2 includes a processing vessel 8 configured to contain therein a plurality of objects W to be processed, the objects W including objects 58a to 58e to be processed for temperature measurement, each object 58a to 58e having each corresponding elastic wave element 60a to 60e, a heating means 10 adapted for heating the objects W to be processed, and a holding means 22 adapted to hold the objects W to be processed. To the processing vessel 8, a transmitter antenna 52 adapted to transmit an electric wave for measurement toward each elastic wave element 60a to 60e, and a receiver antenna 52 adapted to receive an electric wave having a frequency corresponding to the temperature and generated from each elastic wave element 60a to 60e are provided. A temperature analyzer 66 adapted to obtain the temperature of the wafers W to be processed for temperature measurement is connected with the receiver antenna 52, and a temperature control unit 64 adapted to control the heating means 10 is in turn connected with the temperature analyzer 66.