Invention Grant
US08089104B2 Integrated circuit with gate electrode level region including multiple linear-shaped conductive structures forming gate electrodes of transistors and including uniformity extending portions of different size 有权
具有栅极电平区域的集成电路,包括形成晶体管的栅极的多个线状导电结构,并且包括不同尺寸的均匀性延伸部分

  • Patent Title: Integrated circuit with gate electrode level region including multiple linear-shaped conductive structures forming gate electrodes of transistors and including uniformity extending portions of different size
  • Patent Title (中): 具有栅极电平区域的集成电路,包括形成晶体管的栅极的多个线状导电结构,并且包括不同尺寸的均匀性延伸部分
  • Application No.: US12572201
    Application Date: 2009-10-01
  • Publication No.: US08089104B2
    Publication Date: 2012-01-03
  • Inventor: Scott T. BeckerMichael C. Smayling
  • Applicant: Scott T. BeckerMichael C. Smayling
  • Applicant Address: US CA Los Gatos
  • Assignee: Tela Innovations, Inc.
  • Current Assignee: Tela Innovations, Inc.
  • Current Assignee Address: US CA Los Gatos
  • Agency: Martine Penilla Group, LLP
  • Main IPC: H01L27/10
  • IPC: H01L27/10
Integrated circuit with gate electrode level region including multiple linear-shaped conductive structures forming gate electrodes of transistors and including uniformity extending portions of different size
Abstract:
A cell layout of a semiconductor device includes a diffusion level layout including a plurality of diffusion region layout shapes, including p-type and n-type diffusion regions. The cell layout also includes a gate electrode level layout defined to include linear-shaped layout features placed to extend in only a first parallel direction. Adjacent linear-shaped layout features that share a common line of extent in the first parallel direction are separated from each other by an end-to-end spacing that is substantially equal across the gate electrode level layout and that is minimized to an extent allowed by a semiconductor device manufacturing capability. Linear-shaped layout features within the gate electrode level layout extend over one or more of the p-type and/or n-type diffusion regions to form PMOS and NMOS transistor devices. A total number of the PMOS and NMOS transistor devices in the cell is greater than or equal to eight.
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