Invention Grant
US08089140B2 Lead frame assembly, lead frame and insulating housing combination, and led module having the same
有权
引线框架组合，引线框架和绝缘外壳组合，以及具有相同功能的LED模块
- Patent Title: Lead frame assembly, lead frame and insulating housing combination, and led module having the same
- Patent Title (中): 引线框架组合，引线框架和绝缘外壳组合，以及具有相同功能的LED模块
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Application No.: US12585715Application Date: 2009-09-23
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Publication No.: US08089140B2Publication Date: 2012-01-03
- Inventor: Shih-Chung Huang , Chen-Hsiu Lin , Meng-Sung Chou
- Applicant: Shih-Chung Huang , Chen-Hsiu Lin , Meng-Sung Chou
- Applicant Address: CN Guangzhou TW Taipei
- Assignee: Silitek Electronic (Guangzhou) Co., Ltd.,Lite-On Technology Corp.
- Current Assignee: Silitek Electronic (Guangzhou) Co., Ltd.,Lite-On Technology Corp.
- Current Assignee Address: CN Guangzhou TW Taipei
- Agency: Rosenberg, Klein & Lee
- Priority: CN200810198897 20080925; CN200910037696 20090305
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A unitary lead frame assembly having a plurality of lead frame sets each comprises a first lead frame unit. The first lead frame unit has a pair of first and second frame portions extending along a first direction and spaced apart from each other along a second direction different from the first direction. The lead frame set further comprises at least two second lead frame units disposed between the first and second frame portions and spaced apart from each other along the second direction. Each of the second lead frame units cooperates with the first lead frame unit to define at least one first die-bonding area therebetween.
Public/Granted literature
- US20100072509A1 Lead frame assembly, lead frame and insulating housing combination, and led module having the same Public/Granted day:2010-03-25
Information query
IPC分类:
