Integrated circuit package system using interposer

Invention Grant

US08089143B2 Integrated circuit package system using interposer 有权

Title translation: 集成电路封装系统采用内插器

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Patent Title: Integrated circuit package system using interposer
Patent Title (中): 集成电路封装系统采用内插器
Application No.: US11162635

Application Date: 2005-09-16
Publication No.: US08089143B2

Publication Date: 2012-01-03
Inventor: Myung Kil Lee
Applicant: Myung Kil Lee
Applicant Address: SG Singapore
Assignee: Stats Chippac Ltd.
Current Assignee: Stats Chippac Ltd.
Current Assignee Address: SG Singapore
Agent Mikio Ishimaru
Main IPC: H01L23/02
IPC: H01L23/02

Integrated circuit package system using interposer

Abstract:

An integrated circuit package system is provided in which an interposer of predetermined thickness including a central cavity is formed. Additionally, one or more contacts are formed around the central cavity on the interposer. The interposer is employed for connecting first and second packages.

Abstract(Chinese):

提供一种集成电路封装系统，其中形成包括中心腔的预定厚度的插入件。另外，一个或多个触点形成在插入件上的中心腔周围。插入器用于连接第一和第二封装。

Public/Granted literature

US20060175695A1 INTEGRATED CIRCUIT PACKAGE SYSTEM USING INTERPOSER Public/Granted day:2006-08-10

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L23/00	半导体或其他固态器件的零部件（H01L25/00优先）
H01L23/02	.容器；封接（H01L23/12，H01L23/34，H01L23/48，H01L23/552优先）