Invention Grant
- Patent Title: Inductor mount method and apparatus
- Patent Title (中): 电感安装方法和装置
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Application No.: US13118211Application Date: 2011-05-27
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Publication No.: US08089333B2Publication Date: 2012-01-03
- Inventor: Grant A. MacLennan
- Applicant: Grant A. MacLennan
- Agent Kevin Hazen
- Main IPC: H01F27/26
- IPC: H01F27/26

Abstract:
The invention comprises an inductor mounting method and apparatus. An about annular inductor is mounted using a non-conducting clamp element passing at least into a center opening of the inductor. Mounting hardware forces the clamp element toward a mounting surface to edge mount the inductor, where the mounting hardware, non-conducting clamp element, and mounting surface minimally contact the inductor. The minimal contact allows greater surface area for liquid, convective, and/or radiative cooling of the inductor. The inductor is optionally composed of particles of magnetic material coated with carbon and embedded into an epoxy to yield a distributed gap material.
Public/Granted literature
- US20110227680A1 INDUCTOR MOUNT METHOD AND APPARATUS Public/Granted day:2011-09-22
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