Invention Grant
- Patent Title: Thick film layered resistive device employing a dielectric tape
- Patent Title (中): 使用介质带的厚膜分层电阻器件
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Application No.: US11779703Application Date: 2007-07-18
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Publication No.: US08089337B2Publication Date: 2012-01-03
- Inventor: Roger Brummell , Angie Privett
- Applicant: Roger Brummell , Angie Privett
- Applicant Address: US MO St. Louis
- Assignee: Watlow Electric Manufacturing Company
- Current Assignee: Watlow Electric Manufacturing Company
- Current Assignee Address: US MO St. Louis
- Agency: Brinks Hofer Gilson & Lione
- Main IPC: H01C7/18
- IPC: H01C7/18

Abstract:
A resistive device for use in providing a resistive load to a target under the application of power from a power source is provided, the resistive device being adapted for electrical connection to the power source through a pair of terminal wires. The resistive device includes a thick film material, and the thick film material defines at least one layer of tape. The resistive device can be, by way of example, a heater or a load resistor, and can also include a substrate onto which a layer of dielectric tape is disposed, a resistive layer disposed on the layer of dielectric tape, and a protective layer disposed on the resistive layer.
Public/Granted literature
- US20090021342A1 Thick Film Layered Resistive Device Employing a Dielectric Tape Public/Granted day:2009-01-22
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