Invention Grant
- Patent Title: Apparatus, system, and method of power supply disposition and cooling
- Patent Title (中): 电源配置和冷却的设备,系统和方法
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Application No.: US12729845Application Date: 2010-03-23
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Publication No.: US08089762B2Publication Date: 2012-01-03
- Inventor: Albert V. Makley , Timothy S. Farrow , William F. Martin-Otto , Marc R. Pamley
- Applicant: Albert V. Makley , Timothy S. Farrow , William F. Martin-Otto , Marc R. Pamley
- Applicant Address: SG Tech Park
- Assignee: Lenovo (Singapore) Pte. Ltd.
- Current Assignee: Lenovo (Singapore) Pte. Ltd.
- Current Assignee Address: SG Tech Park
- Agency: Kunzler Needham Massey & Thorpe
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
An apparatus, system, and method are disclosed for directing power supply airflow.A power supply is disposed adjacent a first end of a chassis. The chassis comprises a z axis from the first end to a second end of the chassis and an x axis orthogonal to the z axis. A bay is disposed adjacent the first end of the chassis along the x axis from the power supply. The bay comprises at least one storage device. A chamber is disposed adjacent the first end of the chassis adjacent the bay along the x axis between the bay and the power supply. A first baffle is disposed offset from the power supply, the bay, and the chamber along the z axis toward the second end. The first baffle forms a first section and isolates a first airflow in the first section from a second airflow.
Public/Granted literature
- US20110235261A1 APPARATUS, SYSTEM, AND METHOD OF POWER SUPPLY DISPOSITION AND COOLING Public/Granted day:2011-09-29
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