Invention Grant
- Patent Title: Tool-less multi-stage insertion and securing mechanism for electronic mezzanine assemblies
- Patent Title (中): 用于电子夹层组件的无工具多级插入和固定机构
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Application No.: US12187212Application Date: 2008-08-06
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Publication No.: US08089770B2Publication Date: 2012-01-03
- Inventor: Timothy W. Olesiewicz , Patrick T. Conlon , Brett C. Ong
- Applicant: Timothy W. Olesiewicz , Patrick T. Conlon , Brett C. Ong
- Applicant Address: US CA Redwood City
- Assignee: Oracle America, Inc.
- Current Assignee: Oracle America, Inc.
- Current Assignee Address: US CA Redwood City
- Agency: Osha • Liang LLP
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K7/00 ; H05K1/11 ; H05K1/14
Abstract:
A multi-stage mezzanine board mounting assembly within a computer chassis includes a mezzanine tray and mezzanine mounting brackets. The mezzanine tray includes a clamping mechanism. The mezzanine mounting brackets are disposed within the computer chassis and configured to engage with the mezzanine tray when the mezzanine tray is mounted thereon. The clamping mechanism is configured to clamp the mezzanine tray against the mezzanine mounting brackets such that the mezzanine tray is locked in place on the mezzanine mounting brackets. A method of installing a mezzanine board includes disposing mezzanine mounting brackets within a computer chassis; mounting a mezzanine tray onto the mezzanine mounting brackets such that insertion alignment members of the mezzanine tray engage with an engaging portion of the mezzanine mounting brackets; rotating rotatable clamping levers such that the mezzanine tray is locked in place on the mezzanine mounting brackets when the rotatable clamping levers are fully engaged.
Public/Granted literature
- US20100033924A1 TOOL-LESS MULTI-STAGE INSERTION AND SECURING MECHANISM FOR ELECTRONIC MEZZANINE ASSEMBLIES Public/Granted day:2010-02-11
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