Invention Grant
- Patent Title: Low profile package for an implantable device
- Patent Title (中): 用于植入式装置的薄型包装
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Application No.: US12205659Application Date: 2008-09-05
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Publication No.: US08090448B2Publication Date: 2012-01-03
- Inventor: Robert J. Greenberg , Joseph H. Schulman
- Applicant: Robert J. Greenberg , Joseph H. Schulman
- Applicant Address: US CA Sylmar
- Assignee: Second Sight Medical Products, Inc.
- Current Assignee: Second Sight Medical Products, Inc.
- Current Assignee Address: US CA Sylmar
- Agent Scott B. Dunbar
- Main IPC: A61N1/36
- IPC: A61N1/36
Abstract:
The present invention is a low profile hermetic package for an implantable medical device. The package includes a non-conductive substrate including a plurality of straight conductive vias through the non-conductive substrate. A conductive cover hermetically enclosing an electronics circuit is bonded to the non-conductive substrate. The device is low profile. The width of the non-conductive substrate is grater than the height of the cover.
Public/Granted literature
- US20090005835A1 Low Profile Package for an Implantable Device Public/Granted day:2009-01-01
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