Invention Grant
- Patent Title: Device and method for connecting device manufacturing processing apparatuses, program, device manufacturing processing system, exposure apparatus and method, and measurement and inspection apparatus and method
- Patent Title (中): 用于连接装置制造处理装置，程序，装置制造处理系统，曝光装置和方法的装置和方法，以及测量和检查装置和方法
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Application No.: US11585816Application Date: 2006-10-25
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Publication No.: US08090875B2Publication Date: 2012-01-03
- Inventor: Shinichi Okita
- Applicant: Shinichi Okita
- Applicant Address: JP Tokyo
- Assignee: Nikon Corporation
- Current Assignee: Nikon Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2005-314759 20051028
- Main IPC: G06F15/16
- IPC: G06F15/16
Abstract:
A communication server connects together device manufacturing processing apparatuses such as exposure apparatuses and various inspection apparatuses and the like. This communication server is provided with a file format conversion section that converts the format of data exchanged between device manufacturing processing apparatuses, a communication message conversion section that converts communication messages, and a communication protocol conversion section that converts communication protocols. The communication server receives information transmitted from a transmission source compatibly with a device manufacturing processing apparatus which is the transmission source, and transmits the received information compatibly with a device manufacturing processing apparatus that is a destination of the transmission.
Public/Granted literature
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