Invention Grant
- Patent Title: Hinge assembly for collapsable electronic device
- Patent Title (中): 可折叠电子设备的铰链组件
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Application No.: US12472526Application Date: 2009-05-27
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Publication No.: US08091179B2Publication Date: 2012-01-10
- Inventor: Jin-Xin Wang , Jian Li
- Applicant: Jin-Xin Wang , Jian Li
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200810304655 20080925
- Main IPC: E05C17/64
- IPC: E05C17/64

Abstract:
A hinge assembly includes a pivot shaft having a pivot portion, a friction member sleeved on the pivot portion, a support member, and an adjusting member. The pivot shaft includes a pivot portion. The friction member includes a first friction body and a second friction body attached to the first friction body. The support member includes a housing, and defines a receiving chamber in the housing and an adjusting hole communicating with the receiving chamber. The friction member and the pivot portion of the pivot shaft are received in the chamber. An inner wall of the receiving chamber presses the friction member to clamp the pivot portion. The adjusting member is received in the at least one adjusting hole to abut the friction member such that the friction created between the friction member and the pivot portion can be adjusted.
Public/Granted literature
- US20100071161A1 HINGE ASSEMBLY FOR COLLAPSABLE ELECTRONIC DEVICE Public/Granted day:2010-03-25
Information query
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