Invention Grant
- Patent Title: Wire grip
- Patent Title (中): 线夹
-
Application No.: US12222395Application Date: 2008-08-08
-
Publication No.: US08091183B2Publication Date: 2012-01-10
- Inventor: Chu Geng Lin
- Applicant: Chu Geng Lin
- Applicant Address: TW Tu-Cheng, Taipei Hsien
- Assignee: Cheng Uei Precision Industry Co., Ltd.
- Current Assignee: Cheng Uei Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, Taipei Hsien
- Agent Cheng-Ju Chiang
- Main IPC: G01N3/04
- IPC: G01N3/04

Abstract:
A wire grip is adapted for fastening a wire and mounted to a tension device which pulls the wire grip to produce a pulling force to the wire. The wire grip includes a basic body and a capstan. The capstan is slidably mounted to the basic body for fastening an end portion of the wire and enabling the wire to be wrapped thereon. The capstan is movable in a direction relative to an axis thereof whereby to ensure the pulling force provided by the tension device is in alignment direction with the pulling force received by a middle portion of the wire.
Public/Granted literature
- US20100031480A1 Wire grip Public/Granted day:2010-02-11
Information query