Invention Grant
- Patent Title: Method for manufacturing a substrate for a liquid ejection element
- Patent Title (中): 液体喷射元件用基板的制造方法
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Application No.: US12434278Application Date: 2009-05-01
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Publication No.: US08091235B2Publication Date: 2012-01-10
- Inventor: Hirokazu Komuro
- Applicant: Hirokazu Komuro
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2004/210141 20040716
- Main IPC: B21D53/76
- IPC: B21D53/76 ; G01D15/00 ; B41J2/045

Abstract:
A manufacturing method for manufacturing a liquid ejection element including a liquid flow path which is open at an ejection outlet for ejecting liquid, and an energy generating member for generating energy usable for ejecting the liquid from liquid flow path through the ejection outlet, the manufacturing method, includes a step of forming the energy generating member on a front side of a substrate; a step of forming a top plate member on the side having the energy generating member formed by the energy generating member forming step, wherein the top plate member is a member in which the liquid flow path and the ejection outlet are formed; and a step of thinning the substrate, having the top plate member formed thereon by the top plate member forming step, from a back side thereof.
Public/Granted literature
- US20090211093A1 LIQUID EJECTION ELEMENT AND MANUFACTURING METHOD THEREFOR Public/Granted day:2009-08-27
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