Invention Grant
- Patent Title: Wall and floor systems
- Patent Title (中): 墙壁和地板系统
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Application No.: US12548694Application Date: 2009-08-27
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Publication No.: US08091316B2Publication Date: 2012-01-10
- Inventor: John R. Beck , Michael D. Whitticar
- Applicant: John R. Beck , Michael D. Whitticar
- Applicant Address: US OH Columbus
- Assignee: Dietrich Industries, Inc.
- Current Assignee: Dietrich Industries, Inc.
- Current Assignee Address: US OH Columbus
- Agency: Fay Sharpe LLP
- Main IPC: E04H12/00
- IPC: E04H12/00

Abstract:
Wall and floor connection arrangements. In various embodiments, a first a joist rim is coupled to the flanges of at least some vertically extending studs such that an upper rim flange of the first joist rim is substantially coplanar with a portion of an upper track of the wall. A second joist rim is coupled to another lateral flange of at least some of the vertically extending studs such that an upper rim flange of the second joist rim is substantially coplanar with a portion of the upper track and the upper rim flange of the first joist rim. A plurality of first joists may be coupled to the first rim and plurality of second joists may be coupled to the second rim. A floor deck may be received on the upper track as well as the upper flanges of the first and second joist rims.
Public/Granted literature
- US20100037546A1 WALL AND FLOOR SYSTEMS Public/Granted day:2010-02-18
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