Invention Grant
- Patent Title: Method for packaging surgical sutures
- Patent Title (中): 包装手术缝线的方法
-
Application No.: US12572381Application Date: 2009-10-02
-
Publication No.: US08091321B2Publication Date: 2012-01-10
- Inventor: Stan Malinowski , Mario Santangelo
- Applicant: Stan Malinowski , Mario Santangelo
- Applicant Address: US CT North Haven
- Assignee: Tyco Healthcare Group LP
- Current Assignee: Tyco Healthcare Group LP
- Current Assignee Address: US CT North Haven
- Main IPC: B65B63/04
- IPC: B65B63/04

Abstract:
A surgical suture package for storing at least one surgical suture includes an outer jacket having a plurality of panels foldably connected to each other and adapted to fold upon each other to form an inner pocket and an inner retainer for positioning within the pocket of the outer jacket. The inner retainer includes a row of support panels having a main support panel for supporting the at least one suture, and a pair of side support panels foldably connected to the main support panel along respective opposed major sides of the main support panel. The side support panels are adapted to be folded onto the main support panel to at least partially enclose the at least one suture. A cover panel is foldably connected to the main support panel along a minor side of the main support panel, and is adapted to be folded onto the support panels. A row of closure panels including a main closure panel is foldably connected to the main support panel along a second minor side of the main closure panel, and a pair of side closure panels is foldably connected to the main closure panel along respective opposed major sides of the main closure panel. The main closure panel is adapted to be folded along the second minor side of the main support panel onto the main support panel and the side closure panels are adapted to be folded along the major sides of the main closure panel to at least partially enclose the support and cover panels.
Public/Granted literature
- US20100018164A1 Packaging For Surgical Sutures Public/Granted day:2010-01-28
Information query