Invention Grant
- Patent Title: Pressure sensor
- Patent Title (中): 压力传感器
-
Application No.: US12838806Application Date: 2010-07-19
-
Publication No.: US08091431B2Publication Date: 2012-01-10
- Inventor: Hisao Motoyama
- Applicant: Hisao Motoyama
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2008-153254 20080611; JP2009-027763 20090209
- Main IPC: G01L9/00
- IPC: G01L9/00

Abstract:
A pressure sensor includes: a housing; a pressure input orifice opened at a pipe sleeve of the housing; a diaphragm sealing the pressure input orifice, the diaphragm having a first surface serving as a pressure receiving surface; a pressure sensitive unit using a direction of detecting a force as a detecting axis. A first end of the pressure sensitive unit is connected to a central area of a second surface of the diaphragm. A second end of the pressure sensitive unit is connected to the housing. The detecting axis is approximately orthogonal to the pressure receiving surface. A circumference of a portion where the central area and the first end of the pressure sensitive unit are in contact with each other is located inside a circumference of the central area. A thickness of the central area is larger than a thickness of an area surrounding the central area.
Public/Granted literature
- US20100275698A1 PRESSURE SENSOR Public/Granted day:2010-11-04
Information query