A method of cleaning a spin coater apparatus is provided. In one embodiment, the method comprises providing a spin coater apparatus having a coater cup comprising a basin with sidewalls, a rotatable platform situated inside the cup adapted for holding and rotating a wafer to be coated, and a solvent dispensing means mounted under the rotatable platform; placing the substrate on the rotatable platform; rotating the rotatable platform; continuously dispensing a cleaning solvent from the solvent dispensing means to rinse the backside of the wafer with the cleaning solvent and to pre-wet an interior surface of the sidewalls; and dispensing a coating material upon the wafer, the substrate mounted on the rotatable platform.