Invention Grant
- Patent Title: Perforated blister packaging
- Patent Title (中): 穿孔泡罩包装
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Application No.: US12937885Application Date: 2008-05-28
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Publication No.: US08091704B2Publication Date: 2012-01-10
- Inventor: Larry Trigg
- Applicant: Larry Trigg
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- International Application: PCT/US2008/065002 WO 20080528
- International Announcement: WO2009/145765 WO 20091203
- Main IPC: B65D73/00
- IPC: B65D73/00
Abstract:
A blister package includes a plastic blister being between top and bottom covers. The plastic blister further includes a perforation that partially extends around a product enclosure. A cut line intersects the perforation along an interior portion of the plastic blister to provide a location for tearing the product enclosure from the plastic blister.
Public/Granted literature
- US20110031150A1 Perforated Blister Packaging Public/Granted day:2011-02-10
Information query
