Invention Grant
- Patent Title: Wireless telemetry circuit structure for measuring temperature in high temperature environments
- Patent Title (中): 用于测量高温环境温度的无线遥测电路结构
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Application No.: US12192366Application Date: 2008-08-15
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Publication No.: US08092080B2Publication Date: 2012-01-10
- Inventor: David J. Mitchell , Anand A. Kulkarni , Ramesh Subramanian , Edward R. Roesch , Rod Waits , Roberto Schupbach , John R. Fraley , Alexander B. Lostetter , Brice McPherson , Bryon Western
- Applicant: David J. Mitchell , Anand A. Kulkarni , Ramesh Subramanian , Edward R. Roesch , Rod Waits , Roberto Schupbach , John R. Fraley , Alexander B. Lostetter , Brice McPherson , Bryon Western
- Applicant Address: US FL Orlando
- Assignee: Siemens Energy, Inc.
- Current Assignee: Siemens Energy, Inc.
- Current Assignee Address: US FL Orlando
- Main IPC: G01K1/00
- IPC: G01K1/00

Abstract:
A circuit affixed to a moving part of an engine for sensing and processing the temperature of the part. The circuit generates a signal representative of the temperature sensed by a thermocouple (110) and amplified by an amplifier (112). A square wave oscillator (113) with a temperature sensitive capacitor (C8) varies its frequency in response to changes of a local temperature of the circuit. A chopper (114, J27) converts the output of the amplifier into an alternating current signal. The chopper is gated by the square wave oscillator and a second input is coupled to an output of the amplifier. Thus, the chopper has an output signal having a frequency representative of the local temperature and an amplitude representative of the thermocouple temperature, whereby the combined signals represent the true temperature of the part.
Public/Granted literature
- US20100039288A1 Wireless Telemetry Circuit Structure for Measuring Temperature in High Temperature Environments Public/Granted day:2010-02-18
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