Invention Grant
- Patent Title: Large area substrate processing system with between chamber platform
- Patent Title (中): 大面积基板处理系统与室间平台
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Application No.: US12643034Application Date: 2009-12-21
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Publication No.: US08092138B2Publication Date: 2012-01-10
- Inventor: Thomas L. Duer , John A. Miller
- Applicant: Thomas L. Duer , John A. Miller
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, L.L.P.
- Main IPC: H01L21/677
- IPC: H01L21/677

Abstract:
Embodiments of the invention generally relate to a vacuum processing system for processing large area substrates, such as flat panel displays (i.e., LCD, OLED, and other types of flat panel displays), solar panels, and the like. In one embodiment, a vacuum processing system includes a plurality of processing chambers coupled to a vacuum transfer chamber suitable to accommodate a large area substrate and a least one horizontal platform disposed between adjacent processing chambers. The vacuum transfer chamber has a robot disposed therein. The platform is coupled to a base supporting one of the adjacent processing chambers.
Public/Granted literature
- US20100158642A1 LARGE AREA SUBSTRATE PROCESSING SYSTEM WITH BETWEEN CHAMBER PLATFORM Public/Granted day:2010-06-24
Information query
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