Invention Grant
US08092263B2 Process for producing connector and connector produced by the same process
有权
用于生产连接器和连接器的方法由相同的工艺生产
- Patent Title: Process for producing connector and connector produced by the same process
- Patent Title (中): 用于生产连接器和连接器的方法由相同的工艺生产
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Application No.: US12452523Application Date: 2008-07-07
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Publication No.: US08092263B2Publication Date: 2012-01-10
- Inventor: Hiroyuki Moriuchi , Yoshihiro Tadokoro , Eiichi Mikogai , Yoshiichi Nakano
- Applicant: Hiroyuki Moriuchi , Yoshihiro Tadokoro , Eiichi Mikogai , Yoshiichi Nakano
- Applicant Address: JP Tokyo
- Assignee: DDK Ltd.
- Current Assignee: DDK Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Farjami & Farjami LLP
- Priority: JP2007-177867 20070706
- International Application: PCT/JP2008/062644 WO 20080707
- International Announcement: WO2009/008526 WO 20090115
- Main IPC: H01R13/03
- IPC: H01R13/03

Abstract:
An object of the invention is to provide a process for providing a connector, which prevents component atoms constituting a material and a substrate layer from diffusing into a tin-containing material layer and suppressing an occurrence of external force-type whiskers upon the application of external force to a surface of the tin-containing material layer, and a connector produced by the same process. In a production process of a connector comprising a step of providing a substrate layer on a surface of the material to surface treat the material and a step of providing a tin-containing material layer on an upside of the substrate layer to surface treat the substrate layer, the object can be achieved by further comprising a step of providing a barrier intermediate layer before the provision of the tin-containing material layer.
Public/Granted literature
- US20100255735A1 PROCESS FOR PRODUCING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT PRODUCED BY THE SAME PROCESS Public/Granted day:2010-10-07
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