Invention Grant
- Patent Title: Substrate polishing metrology using interference signals
- Patent Title (中): 使用干涉信号的基板抛光计量
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Application No.: US12955690Application Date: 2010-11-29
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Publication No.: US08092274B2Publication Date: 2012-01-10
- Inventor: Manoocher Birang , Grigory Pyatigorsky
- Applicant: Manoocher Birang , Grigory Pyatigorsky
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- Main IPC: B24B49/00
- IPC: B24B49/00
Abstract:
A polishing pad assembly for a chemical mechanical polishing apparatus includes a polishing pad having a polishing surface and a surface opposite the polishing surface for attachment to a platen, and a solid light-transmissive window formed in the polishing pad. The light-transmissive window is more transmissive to light than the polishing pad. The light-transmissive window has a light-diffusing bottom surface.
Public/Granted literature
- US20110070808A1 SUBSTRATE POLISHING METROLOGY USING INTERFERENCE SIGNALS Public/Granted day:2011-03-24
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