Invention Grant
- Patent Title: Solid electrolytic condenser and apparatus and method for forming insulating layer of the solid electrolytic condenser
- Patent Title (中): 固体电解电容器及固体电解电容器绝缘层形成装置及方法
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Application No.: US12211449Application Date: 2008-09-16
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Publication No.: US08092556B2Publication Date: 2012-01-10
- Inventor: Jae Jun Park , Hwa Sung Hwang , Tae Hun Kang
- Applicant: Jae Jun Park , Hwa Sung Hwang , Tae Hun Kang
- Applicant Address: KR Gyunggi-do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-do
- Agency: Lowe, Hauptman, Ham & Berner, LLP
- Priority: KR10-2008-0057337 20080618
- Main IPC: H01G9/00
- IPC: H01G9/00
Abstract:
The present invention provides a solid electrolytic condenser including a condenser element with anode polarity; an anode wire with one side inserted inside the condenser element and the other side projected outside the condenser element; and an insulating layer formed by coating one surface of the condenser element and an exposed region of the anode wire adjacent to the one surface of the condenser element with a liquid insulating material through a non-contact scattering method and an apparatus and a method for forming the insulating layer of the solid electrolytic condenser.
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