Invention Grant
- Patent Title: Cutting tool
- Patent Title (中): 切割用具
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Application No.: US12521282Application Date: 2006-12-26
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Publication No.: US08092561B2Publication Date: 2012-01-10
- Inventor: Kwon Hee Park , Sung Su Chun , Sang Woong Na
- Applicant: Kwon Hee Park , Sung Su Chun , Sang Woong Na
- Applicant Address: KR Daegu
- Assignee: TaeguTec, Ltd.
- Current Assignee: TaeguTec, Ltd.
- Current Assignee Address: KR Daegu
- Agency: Womble Carlyle
- International Application: PCT/KR2006/005707 WO 20061226
- International Announcement: WO2008/078845 WO 20080703
- Main IPC: B24B1/00
- IPC: B24B1/00 ; B24D11/00 ; B32B9/00 ; B32B19/00 ; B23P15/28 ; B26D1/00 ; B26D3/00

Abstract:
A cutting tool including a fine and uniform alumina-based substrate is disclosed herein. In an exemplary embodiment, the alumina-based substrate includes 0.1 to 25% by volume of one or more metal oxides, or 5 to 80% by volume of metal carbonitride and 0.01 to 10% by volume of one or more metal oxides. Metal constituting the metal oxide and the metal carbonitride is selected from the group consisting of elements from Groups III to VI (including La group and Ac group) of the periodic table, Mg and Co. The metal oxides added to alumina reside at the boundaries of alumina grains, thereby prohibiting the alumina grains from growing excessively during a sintering process.
Public/Granted literature
- US20100037532A1 Cutting Tool Public/Granted day:2010-02-18
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