Invention Grant
- Patent Title: Bonding material composition and method for manufacturing the same, and joined body and method for manufacturing the same
- Patent Title (中): 粘合材料组合物及其制造方法，以及接合体及其制造方法
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Application No.: US11951682Application Date: 2007-12-06
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Publication No.: US08092624B2Publication Date: 2012-01-10
- Inventor: Takahiro Tomita , Kenji Morimoto , Katsuhiro Inoue , Masaaki Kawai , Suguru Kodama
- Applicant: Takahiro Tomita , Kenji Morimoto , Katsuhiro Inoue , Masaaki Kawai , Suguru Kodama
- Applicant Address: JP Nagoya
- Assignee: NGK Insulators, Ltd.
- Current Assignee: NGK Insulators, Ltd.
- Current Assignee Address: JP Nagoya
- Agency: Oliff & Berridge, PLC
- Priority: JP2006-330510 20061207; JP2007-280677 20071029
- Main IPC: B32B3/12
- IPC: B32B3/12 ; B28B1/30 ; B29B65/00 ; B29B7/00 ; B31B1/62 ; C04B37/00
Abstract:
There is provided a bonding material composition for obtaining a joined body by unitarily joining two or more members to be joined by means of a bonding material layer, wherein the bonding material composition contains flat particles, non-flat particles, smectite-based clay, and an inorganic adhesive as main components. The bonding material composition costs little, can relax thermal stress generated in the joined body without using fibers which may do harm to a human body, and can reduce defects such as a crack and a void upon drying or a thermal treatment.
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